XHL-04XT Bondtester

Product Description of XHL-04XT Bondtester

The XH Instruments XHL-04XT multi-purpose bondtester is at the forefront of wafer testing technology catering for the testing of wafers，combining technology with the latest automation software delivers unparalleled accuracy, repeatability and results stability.

Principle:

Move the test head to the top of the test sample through the left and right joysticks. During the test, the Z -axis automatically moves down. When the test needle is touched to the surface of the test substrate, Z will stop moving after get signal, Z- axis will move up to the preset shear height . The Y -axis moves at a preset constant speed to perform shear test, When the sample breaks, it automatically stops and the test data is displayed.

Test Standards of XHL-04XT Bondtester

JEITA EIAJ ET-7407, JEDEC JESD22-B117A, JEDEC JESD22-B11, JEDEC JESD22-B116, ASTM F1269, DT/NDT MIL STD 883, MIL STD 883§, MIL STD 883§ ,JEDEC JESD22-B109 ..etc

Product Features of XHL-04XT Bondtester

Technical Parameter of XHL-04XT Bondtester

Push test module	Test accuracy: ±0.25%
Pull test module	Test accuracy: ±0.25%
Sampling Frequency	More than 5000Hz
Various Test Mode	Wire pull,Vector pull, Tweezer pull, Cold bump pull, ball share, peel, die shear..etc
Capacity	According to different test
X-axis	Travel: 200mm, Resolution: 0.001mm
Y-axis	Travel: 160mm, Resolution: 0.001mm
Z-axis	.Travel: 60mm, Resolution: 0.001mm
Test Platform	Can be used with various grips (can be customized)
Operation	PC operation, can display several groups graphs, out put, statistic, save
Air Pressure	0.4-0.6Mpa
Dimension	L660xW355xH590mm
Weight	≤100KG
Power Supply	110V/220V, 50Hz/60Hz

Relative Products of XHL-04XT Bondtester

XHL-02 Computerized Electric Tensile Strength Tester

XHL-04 Computerized Electronic Universal Testing Machine